Dissipating 1 kW Compute Loads in Automotive Packaging
Engineering high-flow liquid cooling plates, dielectric fluids, and predictive thermal throttlers to keep multi-SoC clusters below 85°C junction temperature.
Predictive Workload Throttling
Forecasting temperature spikes from upcoming driving scenarios to ramp up coolant flow ahead of thermal saturation.
- Direct-to-die liquid cooling cold plates delivering < 0.08 K/W thermal resistance.
- Integrated integration with the vehicle's primary high-voltage heat pump loop.
- Real-time thermal monitoring via on-die temperature diodes sampled at 1 kHz.
- Graceful degradation modes preventing sudden perception blackout.
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